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Advanced Institute of Technology silver platinum paste is a thick film paste used for manufacturing electronic components, mainly for making conductive paths or electrodes. Silver platinum paste has a wide range of applications in the electronics industry due to its excellent conductivity, chemical stability, and high temperature resistance.
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The preparation process of silver platinum slurry usually involves mixing silver platinum powder with a binder and organic carrier in a certain proportion, and then thoroughly mixing and grinding until a uniform slurry is formed. During the preparation process, it is necessary to control the proportions and mixing conditions of various raw materials to ensure the performance and quality of the final product.
Product Features
Conductivity: Silver platinum paste has good conductivity due to its main component silver being an excellent conductor.
Antioxidant ability: The silver platinum alloy conductive film fired has good antioxidant ability and can resist oxidation corrosion to a certain extent.
Solderability and resistance to solder corrosion: Silver platinum paste has good solderability and can resist solder corrosion during the welding process, maintaining stable performance.
Initial adhesion: Silver platinum paste has a high initial adhesion and can firmly adhere to the substrate.
Aging resistance: Within a certain temperature and time range (such as aging at 150 ℃ for 100 hours), the performance of silver platinum paste does not decrease much; However, prolonged high-temperature aging (such as 1000 hours) may significantly deteriorate.
Application scope
Thick film circuits: used to make resistors, capacitors, and other passive components.
Sensor electrodes: Suitable for making electrodes for various sensors, such as temperature sensors, pressure sensors, etc.
Integrated circuit: used in the manufacturing of integrated circuits, especially in situations where high temperature resistance and stability are required.
Semiconductor packaging material: used as a conductive path or connecting material for semiconductor packaging.
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