Silver paste for filling holes

With the continuous development of electronic technology, the performance requirements for filling silver paste are also increasing. In the future, filling silver paste will develop towards higher conductivity, better sintering performance, and stronger durability. Meanwhile, with the increasing awareness of environmental protection, green and environmentally friendly filling silver paste will also become the new favorite of the market.

Product Features

High conductivity: The nano silver particles in the filled silver paste have good conductivity and can achieve low resistance connections.

Good sintering performance: Under high temperature conditions, the silver paste filled with pores can be sintered into a dense conductive layer, allowing it to tightly bond with the substrate.

Strong durability: The conductive layer formed after sintering has good wear resistance and corrosion resistance.

Wide applicability: The filling silver paste can be applied to various co fired LTCC systems, including electronic products, communication equipment, automotive electronics, and other fields.

Application scope

Printed Circuit Board (PCB): Suitable for filling through holes, blind holes, and buried holes in multi-layer PCBs.

Semiconductor packaging: can be used for conductive connections in advanced packaging technologies such as chip level packaging (CSP) and ball grid array (BGA).

Microelectronics assembly: suitable for the manufacturing of MEMS devices and other microelectronic components.

Workshop Display