LTCC ceramic substrate conductive silver paste

LTCC ceramic substrate conductive silver paste is a special electronic paste mainly composed of silver powder, glass powder, polymer resin, organic solvents, and inorganic additives. These ingredients are carefully proportioned and mixed to form a paste with good printing performance, cutting performance, and conductivity.

Product Features

Conductivity - Excellent conductivity is one of the basic requirements for silver paste, usually measured by silver content.

Sintering temperature - In order to be compatible with ceramic substrates, silver paste needs to be able to sinter at lower temperatures (generally below 900 ° C), which can avoid the impact of high temperatures on other electronic components.

Mechanical properties such as tensile strength and toughness are crucial for ensuring the reliability and durability of silver paste under long-term use.

Chemical stability - Silver paste should remain stable in the usage environment and not easily oxidized or corroded.

Printability - Silver paste needs to have good printability in order to accurately print the desired pattern through methods such as screen printing.

According to their usage location in LTCC substrates or electronic components, conductive silver paste can be divided into three types: internal electrode paste, external electrode paste, and through-hole filling paste. Among them, the internal electrode slurry is used for the preparation of LTCC internal electrodes; External electrode slurry applied to the surface TOP&BTM of products; The through-hole filling slurry is used to fill the through holes in LTCC substrates.

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