Low temperature co fired ceramic conductive silver paste

Low temperature co fired ceramic conductive silver paste is a conductive paste that uses silver powder as the functional phase, mainly used for electrode fabrication in LTCC technology. It can be sintered at low temperatures and form a good bond with ceramic substrates, thereby achieving high-density interconnection and packaging of electronic components.

Product Features

Good conductivity: Due to the high conductivity of silver powder, low-temperature co fired ceramic conductive silver paste has excellent conductivity.

Excellent thermal conductivity: Silver powder is also an excellent thermal conductive material, which helps to improve the heat dissipation performance of electronic components.

Excellent processability: It can be sintered in air at a low sintering temperature and is suitable for co firing with LTCC substrates.

Good compatibility: By adjusting the particle size, distribution, and content of silver powder and glass powder, as well as using reasonable sintering temperature and time, the sintering compatibility and product reliability of silver paste and LTCC substrate can be ensured.

Strong adhesion: The sintered silver electrode has a strong bonding force with the ceramic substrate, without delamination, cracking, or other phenomena.

Development Trends
With the continuous development of application terminals towards "light, thin, short, and small" direction, LTCC technology has increasingly high requirements for electrode silver paste. In the future, the research and development of LTCC conductive silver paste will focus more on improving its performance indicators, reducing costs, and meeting the application needs of different fields. Meanwhile, with the continuous advancement of materials science and manufacturing processes, the emergence of new conductive materials and preparation methods will also bring more possibilities for the development of LTCC conductive silver paste.

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