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Advanced Institute Technology Speed Control Circuit Thick Film Circuit Silver Palladium Paste: a thick film conductive material specially designed for speed control circuits, using high-quality silver palladium alloy formula to ensure high conductivity and long-term stability. Its excellent wear resistance and corrosion resistance make it an indispensable component in speed control systems, ensuring precise and reliable transmission of circuit signals.
0755-22277778
This product is a high-performance silver palladium alloy conductor paste designed specifically for thick film circuits in speed control circuits. It has excellent oxidation and corrosion resistance, and can maintain good conductivity and mechanical stability at high temperatures. This slurry is suitable for depositing onto ceramic substrates through screen printing technology and forming a stable conductive path through sintering process.
Product Features
High conductivity: Silver, as the main conductive component, endows silver palladium paste with excellent conductivity, enabling speed control circuits and thick film circuits to efficiently transmit current during operation.
Corrosion resistance: The addition of palladium significantly improves the corrosion resistance of the slurry, which can resist the erosion of various corrosive media, thereby extending the service life of the circuit.
Strong adhesion: The silver palladium paste has good adhesion with the substrate, ensuring the stability and reliability of the circuit under various working conditions.
Simple process: Silver palladium paste can be made into a conductive layer through simple printing, drying, and sintering processes, which improves production efficiency and reduces manufacturing costs.
Stable performance: The conductive layer formed by silver palladium paste can maintain stable performance even in harsh working environments, ensuring the normal operation of the circuit.
Production process
Raw material preparation: Select high-purity silver powder, palladium powder, as well as glass powder and organic carrier that meet the requirements.
Mixing and stirring: Mix each component evenly in a certain proportion to form a stable slurry system.
Printing molding: Using methods such as screen printing to print the paste onto the substrate to form conductive patterns.
Drying and sintering: Drying and sintering the printed circuit to form a dense conductive layer.
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