Copper foil nickel plating

Copper foil nickel plating is a common surface treatment process, mainly plating a layer of nickel metal through electrochemical methods on the surface of copper foil. This process is mainly used to improve the electrical conductivity, corrosion resistance and welding performance of copper foil, and is widely used in electronics, photovoltaic, new energy vehicles, electricians, communications and other fields.

1. Preparation before nickel plating: Before nickel plating, you need to clean the surface of the copper foil to remove the impurities and pollutants on the surface. Common cleaning methods include pickling, solvent cleaning and electrochemical cleaning.

2. Nickel plating process parameters: The process parameters of nickel plating include the ingredients, temperature, current density, and pH value of the plating solution. The selection and control of these parameters directly affect the quality and performance of the plating layer, and needs to be optimized according to specific application needs.

3. Solid ingredients: Common copper foil nickel plating liquid components include nickel salt, acidic additives, complexing agents, etc. Nickel salts are generally nickel sulfate or nickel chloride. Acidic additives can adjust the pH value of the plating fluid. The complexing agent can improve the stability of the plating fluid and the uniformity of the coatings.

4. Nickel plating equipment: Copper foil nickel plating is generally performed by electrolytic grooves. The anode and cathode are laid in the groove. The current is used to use the current to restore nickel surfaces to nickel metals on the cathode surface, and forming plating on the surface of the copper foil. Nickel -plating equipment requires good electrochemical performance, temperature control ability and stirring ability.

5. Plating thickness performance: Nickel -resistant, corrosion resistance and welding performance of copper foil can be obtained through copper foil nickel plating. The thickness and uniformity of the plating layer have an important impact on its performance, and need to be controlled according to the specific application requirements of the customer.

In short, technology copper foil plating of technology of advanced houses is an important surface treatment process that can improve the performance and application scope of copper foil. When selecting process parameters and equipment, you need to optimize according to specific application requirements, and pay attention to controlling the thickness and uniformity of the coating.