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先进院(深圳)科技有限公司

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Frontier News

2025-02-11Testing method and technical standard for heat resistance of PI copper plated film
2025-02-11Exploration of the Relationship between Tensile Strength of PEN Copper Coating and Copper Layer
2025-02-10How to improve the conductivity of platinum powder in electrochemical applications
2025-02-10The difference in melting point between ultrafine gold powder and ordinary gold powder
2025-02-10Application problems and challenges of chip resistor paste in miniaturized electronic components
2025-02-08The attenuation characteristics and improvement methods of radar absorbing materials
2025-02-08How to reduce the thickness of thin film absorbing materials while maintaining excellent absorbing performance?
2025-02-08How to ensure the performance stability of rubber patch type absorbing materials in high or low temperature environments?
2025-02-07How to check whether the conductivity of PI silver plated film meets the standard during use
2025-02-07Exploring the manufacturing process of environmentally friendly PET gold-plated reflective film to reduce harmful substance emissions
2025-02-06How to improve the sintering density of low-temperature sintered solder copper paste?
2025-02-06Optimizing the formula of high sintering copper paste for MLCC to improve the corrosion resistance of the sintered layer
2025-01-22Analysis of Grinding and Removal Process of Electromagnetic Protection Absorbing Coating
2025-01-22How to achieve accurate absorption of electromagnetic waves in specific frequency bands by graphene absorbing materials
2025-01-21The relationship between surface hardness characteristics and gold plating thickness of PET gold-plated film
2024-10-12Technical solution to solve the performance degradation of PI silver plated film in high temperature environment
2024-10-12The impact of poor rheological properties of printing gold paste on printing accuracy and corresponding strategies
2024-10-12Compatibility issues and solutions of conductive silver paste for different types of electronic components
2024-10-11The influence of thermal conductivity and electrical conductivity of pressure sintered silver paste on device performance
2024-10-11How does the composition of pressure sintered silver paste affect its sintering effect
2024-10-11PET镀铝膜与其他包装材料的性能对比
2024-10-10如何控制无压烧结银膏的烧结温度和时间
2024-10-10低温烧结纳米银膏出现颗粒结块的解决办法
2024-10-10低温烧结纳米银膏的生产工艺探析
2024-10-09胶体粒子浓度对导电银铜胶性能的影响研究
2024-10-09银钯浆料印刷时能达到的最小线条分辨率及高精度电路适用性研究
2024-10-09基材表面处理对PET镀金膜的耐摩擦性能确实有影响
2024-10-09PET镀铜膜在包装行业作为导电或防伪标签的潜力探讨
2024-10-09PET镀镍膜在电池隔膜中的导电和稳定性作用研究
2024-10-09PET镀银膜的表面电阻率及其与其他金属镀膜的对比
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