Brazable gold paste

Brazable gold paste is an innovative metal material with unique properties that make it an ideal material connection solution. Gold paste itself is a precious metal paste containing gold, commonly used as a conductive material in thick film microelectronics processes. And the brazed gold paste further enhances its connection and packaging capabilities, especially in situations where high conductivity, high thermal conductivity, and reliable connections are required.

Product Features

Excellent conductivity and thermal conductivity: Gold itself is an excellent conductor, so solderable gold paste performs well in conductivity and thermal conductivity, meeting the demand for high-performance connections in electronic components.

High reliability: Gold paste has long-term stability and can maintain stable performance under various environmental conditions, ensuring the reliability of electronic component connections.

Wide applicability: Solderable gold paste is not only suitable for traditional semiconductor integrated circuit chip connections, but also for other applications that require high-performance connections, such as ceramic circuit board technology.

Development Trends
With the continuous development of the electronics industry, the demand for high-performance connecting materials is also increasing. Brazable gold paste, as a metal material with excellent performance, has broad application prospects in the electronics industry. In the future, with the continuous advancement of technology and the reduction of costs, brazed gold paste is expected to be applied and promoted in more fields.

Workshop Display