Our main products include flexible substrate coating, shielding materials, absorbing materials, precious metal slurries, and more!

banner
Current:Home >Products >Precious metal slurry >Gold conductor slurry >Gold through-hole column paste
Gold conductor slurry
Gold through-hole column paste
  • Gold through-hole column paste
  • Gold through-hole column paste
  • Gold through-hole column paste
  • Gold through-hole column paste
  • Gold through-hole column paste

Gold through-hole column paste

Advanced Institute Technology's gold through-hole paste is designed specifically for electronic components such as MLCC, blending high-quality gold powder with carefully selected glass powder to ensure excellent conductivity and a sturdy metallization layer. Suitable for high-temperature sintering, achieving stable and reliable electrical connections, meeting high-density packaging requirements, it is the preferred material for manufacturing high-performance electronic components.Come to our information center to learn moreTechnical data of gold paste

Hotline

0755-22277778

Gold through-hole column slurry isA material widely used in the electronics industry, mainly used for connecting through holes in electronic products to ensure the reliability and stability of connections between electronic components.

金通孔柱浆料

Product Features

Excellent conductivity: Due to the presence of high-quality conductive materials such as gold and silver, the gold through-hole paste can effectively conduct current and establish stable electrical connections between the through-hole columns.

Excellent mechanical strength: By optimizing the formula and sintering process, the slurry endows the through-hole column with excellent mechanical strength and durability, enabling it to maintain its functionality and performance in extreme working environments.

Good corrosion resistance: The gold through-hole column slurry can resist common chemical corrosion and maintain the stability and reliability of the through-hole column.

Good processability: It can be applied in the manufacturing process of electronic components through spraying, printing, or coating, and can achieve uniform and stable coating thickness.

金通孔柱浆料
Application scope

Circuit board manufacturing: During the circuit board manufacturing process, gold through-hole paste is used to fill the connection holes to ensure stable connection of various components on the circuit board.

Manufacturing of electronic components: In the manufacturing process of electronic components such as integrated circuits, resistors, capacitors, etc., through-hole paste also plays an important role

Workshop Display
车间图应用领域联系我们

金通孔柱浆料参数金通孔柱浆料参数
Recommended products
Hotline
0755-22277778
13826586185(Mr.Duan)
Wechat QRcode