Discrete Device Conductive Silver Adhesive

Discrete device conductive silver adhesive is a special adhesive specifically used for packaging and bonding electronic discrete devices. This adhesive contains silver particles as conductive fillers, which can cure under low temperature conditions and have good conductivity and adhesive properties.

Product Features

High performance and low-temperature rapid curing: Conductive silver paste has the characteristics of single component and high performance, and can be quickly cured at low temperatures. The required curing temperature is much lower than the tin lead welding temperature, avoiding material deformation, thermal damage to electronic devices, and the formation of internal stress that may be caused by high welding temperatures.

Stable resistance impedance: The resistance impedance of conductive silver paste is stable, with minimal impedance changes before and after reliability testing, and less silver migration phenomenon, ensuring the stability and reliability of electronic components.

Simple process and easy operation: The conductive silver adhesive process is simple and easy to operate, suitable for assembly line operations, and can significantly improve production efficiency.

Environmental friendliness: Conductive silver paste avoids environmental pollution caused by heavy metal lead in tin lead solder and meets the requirements of sustainable development.

Preparation process

Preparation of matrix resin: Select a suitable resin matrix, such as epoxy resin, silicone resin, etc., and thoroughly grind and mix to form a uniform mixture.

Conductive particle addition: Conductive particles (such as silver powder, silver nanowires, etc.) are added to the resin matrix in a certain proportion, and through processes such as stirring and dispersion, the conductive particles are evenly distributed in the resin matrix.

Curing agent addition: Add curing agent to the mixture of conductive particles and resin matrix, and stir and mix thoroughly to evenly disperse the curing agent in the mixture.

Defoaming treatment: The mixed conductive silver paste is subjected to defoaming treatment to remove bubbles and impurities, thereby improving the quality and performance of the conductive silver paste.

Workshop Display