Integrated Circuit Conductive Silver Adhesive

Conductive silver adhesive is a type of adhesive with certain conductivity after curing, especially suitable for packaging and bonding electronic components such as integrated circuits (ICs). The characteristics of single component, high performance, and low-temperature rapid curing make conductive silver paste have broad application prospects in the field of integrated circuit manufacturing.

Product Features

Low temperature rapid curing: The curing temperature of conductive silver paste is much lower than the traditional tin lead welding temperature, which helps to avoid material deformation, thermal damage to electronic devices, and the formation of internal stress that may be caused by high-temperature welding. At the same time, the fast curing characteristic also improves production efficiency.

Stable resistance impedance: The impedance of conductive silver paste changes very little before and after reliability testing, and there is little silver migration phenomenon, ensuring the stability and reliability of circuit connections.

Simple process and easy operation: The use of conductive silver paste is relatively simple and easy to operate, suitable for assembly line operations, thereby improving production efficiency.

Environmental friendliness: The use of conductive silver paste avoids environmental pollution caused by heavy metal lead in tin lead solder, which meets the requirements of modern industry for environmental protection.

Application scope

1. Integrated circuit packaging: used for electrical connection between chips and substrates. Suitable for various types of integrated circuits, such as microprocessors, memory chips, etc.

2. PCB board: used for conductive connections on printed circuit boards, such as chip mounting.

3. FPC (Flexible Circuit Board): Used for conductive connections on flexible circuit boards.

4. VCM camera module: used for electrical connections within the camera module, such as the connection between the lens drive motor and the circuit board.

5. LED packaging: Used for packaging light-emitting diodes (LEDs), especially in applications that require conductive connections.

6. Membrane switches and smart cards: used for bonding conductive layers in membrane switches and smart cards.

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