Ways to improve the heat resistance of PI copper plated film and testing methods

Polyimide (PI) films are widely used in fields such as electronics and aerospace due to their excellent mechanical properties, chemical stability, and high temperature resistance. However, in high-temperature environments, the performance of PI films may be challenged, especially after copper plating, where the thermal stability of the copper layer is crucial for the overall performance of the composite material. This article will explore ways to enhance PI copper plated filmThe approach and corresponding testing methods for heat resistance performance, and introduce the research achievements of Advanced Institute (Shenzhen) Technology Co., Ltd. in this field.

The heat resistance of PI film is closely related to its molecular structure. By adjusting the synthesis formula of PI film, such as introducing high-temperature resistant aromatic dianhydride and diamine monomers, the thermal stability of the film can be effectively improved. Advanced Institute (Shenzhen) Technology Co., Ltd. used a new type of high-temperature resistant monomer in the synthesis process of PI film, which significantly increased the glass transition temperature (Tg) and thermal decomposition temperature (Td) of PI film, laying the foundation for improving the heat resistance of copper plated film.

The traditional electroplating process may result in insufficient adhesion between the copper layer and the PI film, leading to delamination or copper layer peeling in high-temperature environments. Advanced Institute (Shenzhen) Technology Co., LtdA new type of chemical copper plating process has been developed, which optimizes the plating solution formula and process parameters to make the bonding between the copper layer and the PI film more firm. In addition, this process can also form a uniform and dense copper layer, reducing the oxidation and diffusion of the copper layer at high temperatures, thereby improving the heat resistance of the copper plated film.

Adding heat-resistant additives to PI films is an effective method to enhance their heat resistance performance. Advanced Institute (Shenzhen) Technology Co., Ltd. has added nano alumina (Al ₂ O3) particles to the PI film, which can be uniformly dispersed in the PI matrix to form a thermal resistance barrier, effectively reducing the impact of high temperature on the copper layer. At the same time, nano alumina particles can also improve the mechanical strength and thermal stability of PI films, further enhancing the heat resistance of copper plated films.

Thermogravimetric analysis is an important method for evaluating the heat resistance of PI copper plated films. By placing the sample in a high-temperature furnace and recording the curve of its mass change with temperature, it can be determined PI copper plated filmThe thermal decomposition temperature (Td) and weight loss rate. Advanced Institute (Shenzhen) Technology Co., Ltd. found through TGA testing that the weight loss rate of the optimized PI copper plated film was significantly reduced at high temperatures, and the thermal decomposition temperature was increased by about 50 ° C, indicating a significant improvement in its heat resistance.

Differential scanning calorimetry is used to measure the glass transition temperature (Tg) and crystallization behavior of PI copper plated films. Tg is one of the key indicators for measuring the heat resistance of materials, and a higher Tg means that the material can still maintain good mechanical properties at high temperatures. Advanced Institute (Shenzhen) Technology Co., Ltd. found through DSC testing that the Tg of the optimized PI copper plated film increased by about 30 ° C, indicating a significant improvement in its thermal stability at high temperatures.

High temperature tensile testing is used to evaluate the mechanical properties of PI copper plated films at high temperatures. By applying tensile force to the sample in a high-temperature environment and measuring its tensile strength and elongation at break, the strength and toughness of the material at high temperatures can be determined. The test results of Advanced Institute (Shenzhen) Technology Co., Ltd. show that the optimized PI copper plated film has significantly improved tensile strength and elongation at break at high temperatures, indicating that it can still maintain good mechanical properties in high temperature environments.

The thermal cycling test simulated the temperature change environment that PI copper plating film may face in practical applications. By repeatedly cycling the sample between high and low temperatures and observing its performance changes, the thermal stability of the material can be evaluated. The thermal cycle test results of Advanced Institute (Shenzhen) Technology Co., Ltd. show that the optimized PI copper plated film does not show a significant decrease in the bonding force between the copper layer and the PI film after multiple thermal cycles, and there is no obvious delamination or peeling phenomenon, indicating that its heat resistance has been significantly improved.

PI copper plated filmThe heat resistance is crucial for its application in high-temperature environments. By optimizing the formula of PI film, improving the copper plating process, and adding heat-resistant additives, the heat resistance of PI copper plating film can be significantly enhanced. Meanwhile, methods such as thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), high-temperature tensile testing, and thermal cycling testing can effectively evaluate the heat resistance of PI copper plated films. Advanced Institute (Shenzhen) Technology Co., Ltd. has achieved significant results in the research and development of PI copper plating film, providing strong support for the application of this material in fields such as electronics and aerospace.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.