35 micron copper foil nickel plating: paving the golden path for high-end printed circuit boards

Introduction: Copper foil is an important electronic material, and 35 micron copper foil treated with nickel plating has a wide range of applications in high-end printed circuit boards and high-frequency circuit boards. This article will introduce the characteristics and advantages of nickel plating on 35 micron copper foil, and explore its importance in related fields.

1、 Characteristics and advantages of nickel plating on 35 micron copper foil

1.1 High stability

The copper foil with a nickel plating thickness of 35 microns has undergone precise nickel plating treatment, resulting in high stability. In harsh environments such as high temperature, high humidity, and high frequency, 35 micron copper foil is not easily deformed, oxidized, or loses its conductivity, which can ensure the stability and reliability of circuit boards.

1.2 Excellent conductivity

Copper is a metal material with good conductivity, and nickel plating on 35 micron copper foil combines the advantages of both copper foil and nickel. Its conductivity is superior to conventional copper foil, which can meet the requirements of high-frequency circuit boards and provide more stable and efficient signal transmission.

1.3 Excellent adhesion and weldability

After nickel plating treatment, a uniform and dense nickel layer is formed on the surface of 35 micron copper foil. This nickel layer has excellent adhesion and solderability, which can effectively prevent oxidation, corrosion, and other problems when making circuit boards and connecting components, ensuring good connections and long-term stable operation of the circuit board.

2、 Application of 35 micron copper foil nickel plating on high-end printed circuit boards

2.1 Improving Signal Transmission Quality

The production of high-end printed circuit boards has extremely high requirements for signal transmission quality, and 35 micron copper foil nickel plating meets this demand. Its excellent conductivity and stability can ensure low signal transmission loss, reduce signal attenuation and distortion, and improve the transmission quality and reliability of the circuit board.

2.2 Improving the mechanical performance of circuit boards

The nickel layer plated on 35 micron copper foil has high hardness and wear resistance. In the production process of circuit boards, nickel plating can effectively increase the mechanical and tensile strength of copper foil, improve the wear resistance of circuit boards, reduce the risk of damage caused by external forces, and improve the service life of circuit boards.

3、 Application of 35 micron copper foil nickel plating on high-frequency circuit boards

3.1 Improving High Frequency Circuit Performance

High frequency circuits have higher requirements for the material and structure of circuit boards due to the high signal frequency. The conductivity and stability of nickel plated 35 micron copper foil make it very suitable for the production of high-frequency circuit boards. The copper foil treated with nickel plating has lower loss factor and scattering, which can improve the transmission efficiency of high-frequency circuits, reduce signal attenuation, and ensure stable and accurate signal transmission.

3.2 Suppression of high-frequency interference

In high-frequency circuit boards, interference suppression is very important. The surface of a high-frequency circuit board made of 35 micron copper foil plated with nickel forms a uniform shielding layer, which can effectively suppress the radiation and interference of high-frequency signals and improve the anti-interference performance of the circuit board.

Summary:

In the fields of high-end printed circuit boards and high-frequency circuit boards, nickel plating on 35 micron copper foil has important application value. Its high stability, excellent conductivity and solderability, as well as its application advantages in high-frequency circuits, make nickel plating on 35 micron copper foil an ideal choice for producing high-quality electronic products. In the future, with the development of the electronics industry and the demand for product performance