Advanced Institute of Technology Flake Silver PowderIt is a product commonly used for low-temperature curing electronic pastes. It has multiple brand specifications, such as YB-8910, YB-8920, and YB-8930. Each grade specification has different particle sizes and densities, suitable for different electronic pastes.
Firstly, let's understand the specifications of YB-8910 flake silver powder. Its D10 value is between 2.0-4.0 μ m, D50 value is between 5.0-8.0 μ m, and D90 value is between 8.0-15.0 μ m. The density of this silver powder is in the range of 1.6-2.4 g/cm3, which is relatively light. Its specific surface area is 0.8-1.5m2/g, and its surface morphology is sheet-like. This silver powder is suitable for low-temperature curing electronic pastes with low to medium silver content.
Next is YB-8920 flake silver powder. Its particle size is similar to YB-8910, with D10 values between 2.0-4.0 μ m, D50 values between 5.0-8.0 μ m, and D90 values between 8.0-15.0 μ m. The density range is between 3.0-4.2 g/cm3, which is higher than YB-8910. Similarly, the surface morphology of the flake silver powder is also flake like, with a specific surface area of 0.8-1.5m2/g. YB-8920 is suitable for low-temperature curing electronic pastes with low to medium silver content.
Finally, YB-8930 flake silver powder. Its particle size is relatively small, with D10 values between 1.0-2.0 μ m, D50 values between 2.0-4.0 μ m, and D90 values between 3.0-5.0 μ m. This silver powder is suitable for both high silver content low-temperature curing electronic pastes and sintering pastes. Unlike the previous two types of flake silver powders, YB-8930 does not provide clear density and specific surface area data.
Flake silver powder has a wide range of applications in the electronics industry due to its unique form and specifications. Low temperature curing electronic paste requires silver powder to be able to cure at lower temperatures to avoid damage to the substrate or other components. Electronic pastes with low to medium silver content are suitable for applications that do not require high silver content, while electronic pastes with high silver content are suitable for applications that require higher conductivity. This requires the selection of particle size and density of flake silver powder to match different applications.
Overall, flake silver powder is an effective method
Low temperature curing electronic pasteThe additive. Advanced Institute Technology's various grades and specifications of silver powder have different particle sizes, densities, and specific surface areas to meet the needs of different applications. By selecting appropriate grades and specifications of flake silver powder, the performance and conductivity of electronic pastes can be improved, thereby contributing to the development of the electronics industry.
