Our main products include flexible substrate coating, shielding materials, absorbing materials, precious metal slurries, and more!

Provide customers with professional and convenient electromagnetic shielding and conductive material application solutions

Flexible electrode materials, shielding materials, conductive materials, absorbing materials, and new material technology solution providers

Hotline
Hotline
13826586185(Mr. Duan)
duanlian@xianjinyuan.cn
banner
Current：Home >Company news >Company news >通金浆料是低温共烧陶瓷(LTCC)基板配套的系列电子浆料
News center

Hotline:0755-22277778 Tel：0755-22277778 
Mobile：13826586185（Mr.Duan）
Fax：0755-22277776
E-mail：duanlian@xianjinyuan.cn

Company news

通金浆料是低温共烧陶瓷(LTCC)基板配套的系列电子浆料

Time：2022-05-22Number：1298

通孔金浆料是低温共烧陶瓷(LTCC)基板配套的系列电子浆料中必不可少的一种材料,对金粉有很高的要求。用抗坏血酸还原体系制备金粉,研究硝酸银溶液浓度、p H值、还原剂浓度对银粉形貌及粒度分布的影响,采用扫描电子显微镜对制备的金粉进行表征分析,选取3种不同类型的银粉调制成通孔金浆进行匹配性试验。结果表明,均一性、分散性良好且平均粒径为2.0μm的球形超细金粉具有较好的应用潜力

金浆

image.png

Back
Related news
Coating on flexible substrates
Precious metal slurry
Shielding materials
Absorbing material
Company news
Hotline
0755-22277778
13826586185(Mr.Duan)
Wechat QRcode

先进院(深圳)科技有限公司，© 2021 www.leird.cn. All rights reserved  粤ICP备2021051947号-1  © 2021 www.xianjinyuan.cn. All rights reserved  粤ICP备2021051947号-2