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Company news

Application of Conductive Silver Adhesive for High Strength Metal Packaging

Time:2021-12-19Number:1413

Conductive silver adhesive for high-strength metal packaging
Conductive Adhesive
Heat curing/high adhesive strength/reflow soldering resistance
It is a high-strength conductive silver adhesive for modified metal packaging, which does not contain solvents and requires low-temperature storage (around 0 ℃). It can be used for packaging and bonding of metal shells. Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, and excellent conductivity.
Purpose: Packaging and bonding of metal shells.
Specialty:
Smooth dispensing
The adhesive point does not collapse, does not spread, and has good shape retention
Excellent conductivity
Very high adhesive strength
Excellent drop resistance performance
Low price

 

导电银胶

Pre curing characteristics

Items

Data

Remark

project

Measurement value

Preparing for exams

Appearance

Silver

appearance

silver gray

Viscosity

10-15Pa·s

Brookfield 52Z ,5rpm

viscosity

Specific gravity

2.2

Cup

proportion

Specific gravity cup

GB/T 13354-1992

UV Cure time

30-40minutes

140℃-150℃

Curing time

Storage

3months

-5℃-5℃

Storage conditions

7days

25℃

Characteristics after curing

Items

Data

Remark

project

Measurement value

Preparing for exams

Pencil hardness

2H-6H

Hardness (pencil hardness)

Lap shear strength

50MPa

Glass/nickel plated copper sheet

shear strength

10mm/min

Peel strength

91N/25mm

Glass/nickel plated copper sheet

peel strength

50mm/min

Volume resistivity

0.0001ΩNaN(410TS)

0.0001ΩNaN(450TS)

150℃*30min

Volume resistance



导电银胶

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