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Conductive silver adhesive for high-strength metal packaging
Conductive Adhesive
Heat curing/high adhesive strength/reflow soldering resistance
It is a high-strength conductive silver adhesive for modified metal packaging, which does not contain solvents and requires low-temperature storage (around 0 ℃). It can be used for packaging and bonding of metal shells. Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, and excellent conductivity.
Purpose: Packaging and bonding of metal shells.
Specialty:
Smooth dispensing
The adhesive point does not collapse, does not spread, and has good shape retention
Excellent conductivity
Very high adhesive strength
Excellent drop resistance performance
Low price
Pre curing characteristics
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Appearance |
Silver |
|
appearance |
silver gray |
|
Viscosity |
10-15Pa·s |
Brookfield 52Z ,5rpm |
viscosity |
||
Specific gravity |
2.2 |
Cup |
proportion |
Specific gravity cup GB/T 13354-1992 |
|
UV Cure time |
30-40minutes |
140℃-150℃ |
Curing time |
||
Storage |
3months |
-5℃-5℃ |
Storage conditions |
7days |
25℃ |
Characteristics after curing
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Pencil hardness |
2H-6H |
|
Hardness (pencil hardness) |
||
Lap shear strength |
50MPa |
Glass/nickel plated copper sheet |
shear strength |
10mm/min |
|
Peel strength |
91N/25mm |
Glass/nickel plated copper sheet |
peel strength |
50mm/min |
|
Volume resistivity |
0.0001ΩNaN(410TS) 0.0001ΩNaN(450TS) |
150℃*30min |
Volume resistance |
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