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Company news

Application of halogen-free anisotropic conductive adhesive in the electronic, aerospace, and marine commercial display industry

Time:2021-12-19Number:1335

Halogen free anisotropic conductive adhesive(Conductive Adhesive)
Low temperature hot pressing/high peel strength
Advanced Institute of Technology's anisotropic conductive adhesive research platinum S series is aModified resin anisotropic conductive adhesiveColloidal transparent, halogen-free, meets ROHS and REACH environmental requirements, requires low-temperature storage (around 0 ℃), can be used for FOG connection between touch screen and FPC, and pin corner connection of keyboard circuit.
Purpose: FOG connection, fast up and down conduction connection for thin lines.
Specialty: Smooth printing, non stick and non dry mesh; The hot pressing temperature is relatively low; High adhesive strength; Halogen free (compliant with REACH standards); Colloidal transparency makes it easy to align.

Pre curing characteristics

Items

Data

Remark

project

Measurement value

Preparing for exams

Appearance

yello

appearance

yellow

Viscosity

50-60Pa·s

Brookfield 52Z ,5rpm

viscosity

Specific gravity

1.07

Cup

proportion

Specific gravity cup

GB/T 13354-1992

Cure time

10-15seconds

140 ℃ -160 ℃ pressure 3Mpa

Curing time

Storage

3months

-Below 5 ℃

Storage conditions

7days

25℃

Characteristics after curing

Items

Data

Remark

project

Measurement value

Preparing for exams

Pencil hardness

HB-4B

Hardness (pencil hardness)

Peel strength

32MPa

Glass/FPC

peel strength

10mm/min

Peel strength

91N/25mm

PET/FPC

peel strength

50mm/min

Volume resistivity

Volume resistance


导电银胶

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