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Halogen free anisotropic conductive adhesive(Conductive Adhesive)
Low temperature hot pressing/high peel strength
Advanced Institute of Technology's anisotropic conductive adhesive research platinum S series is aModified resin anisotropic conductive adhesiveColloidal transparent, halogen-free, meets ROHS and REACH environmental requirements, requires low-temperature storage (around 0 ℃), can be used for FOG connection between touch screen and FPC, and pin corner connection of keyboard circuit.
Purpose: FOG connection, fast up and down conduction connection for thin lines.
Specialty: Smooth printing, non stick and non dry mesh; The hot pressing temperature is relatively low; High adhesive strength; Halogen free (compliant with REACH standards); Colloidal transparency makes it easy to align.
Pre curing characteristics
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Appearance |
yello |
|
appearance |
yellow |
|
Viscosity |
50-60Pa·s |
Brookfield 52Z ,5rpm |
viscosity |
||
Specific gravity |
1.07 |
Cup |
proportion |
Specific gravity cup GB/T 13354-1992 |
|
Cure time |
10-15seconds |
140 ℃ -160 ℃ pressure 3Mpa |
Curing time |
||
Storage |
3months |
-Below 5 ℃ |
Storage conditions |
7days |
25℃ |
Characteristics after curing
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Pencil hardness |
HB-4B |
|
Hardness (pencil hardness) |
||
Peel strength |
32MPa |
Glass/FPC |
peel strength |
10mm/min |
|
Peel strength |
91N/25mm |
PET/FPC |
peel strength |
50mm/min |
|
Volume resistivity |
||
Volume resistance |
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