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Advanced Institute of Technology Conductive Silver AdhesiveThe Yanbo series is a modified epoxy silver adhesive that requires low-temperature storage (around 0 ℃) and can be used for bonding infrared pyroelectric chips. Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, and excellent conductivity.
Purpose: Adhesive bonding of infrared sensor chips
Specialty: Smooth dispensing; The adhesive point does not collapse, does not spread, and has good shape retention; Excellent conductivity; High adhesive strength;
Pre curing characteristics
Items | Data | Remark |
project | Measurement value | Preparing for exams |
Appearance | Silver | |
appearance | silver gray | |
Viscosity | 10-15Pa•s | Brookfield 52Z ,5rpm |
viscosity | ||
Specific gravity | 3.23 | Cup |
proportion | Specific gravity cup GB/T 13354-1992 | |
Cure time | 30-40minutes | 140℃-150℃ |
Curing time | ||
Storage | 3months | -5℃-5℃ |
Storage conditions | 7days | 25℃ |
Characteristics after curing
Items | Data | Remark |
project | Measurement value | Preparing for exams |
Pencil hardness | 4H-7H | |
Hardness (pencil hardness) | ||
Lap shear strength | 30MPa | Glass/nickel plated copper sheet |
shear strength | 10mm/min | |
Peel strength | 91N/25mm | Glass/nickel plated copper sheet |
peel strength | 50mm/min | |
Volume resistivity | 0.0001Ω.cm(410TS) 0.0001Ω.cm(450TS) |
150℃*30min |
Volume resistance |
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