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Company news

Anisotropic conductive adhesive for FOG connection film structure between touch screen and FPC

Time:2021-12-19Number:1406

Used for membrane structureAnisotropic conductive adhesive(Conductive Adhesive)
Low temperature hot pressing/high peel offAdvanced Institute of Technology anisotropic conductive adhesiveThe Yanbo S series is a modified resin type anisotropic conductive adhesive that requires low-temperature storage (around 0 ℃) and can be used for FOG connection between touch screens and FPCs, as well as pin corner connection of keyboard circuits. Mainly used for FOG connection of membrane structure touch screens in the repair market.
Purpose: FOG connection, fast up and down conduction connection for thin lines.
Specialty:
Smooth printing, non stick and non dry mesh;
The hot pressing temperature is relatively low;
The adhesion strength between films is high (close to ACF).

 Pre curing characteristics

Items

Data

Remark

project

Measurement value

Preparing for exams

Appearance

yello

appearance

yellow

Viscosity

50-60Pa·s

Brookfield 52Z ,5rpm

viscosity

Specific gravity

1.07

Cup

proportion

Specific gravity cup

GB/T 13354-1992

Cure time

10-15seconds

140 ℃ -160 ℃ pressure 3Mpa

Curing time

Storage

3months

-Below 5 ℃

Storage conditions

7days

25℃

Characteristics after curing

Items

Data

Remark

project

Measurement value

Preparing for exams

Pencil hardness

HB-4B

Hardness (pencil hardness)

Peel strength

32MPa

Glass/FPC

peel strength

10mm/min

Peel strength

91N/25mm

PET/FPC

peel strength

50mm/min

Volume resistivity

Volume resistance


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