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Used for membrane structureAnisotropic conductive adhesive(Conductive Adhesive)
Low temperature hot pressing/high peel offAdvanced Institute of Technology anisotropic conductive adhesiveThe Yanbo S series is a modified resin type anisotropic conductive adhesive that requires low-temperature storage (around 0 ℃) and can be used for FOG connection between touch screens and FPCs, as well as pin corner connection of keyboard circuits. Mainly used for FOG connection of membrane structure touch screens in the repair market.
Purpose: FOG connection, fast up and down conduction connection for thin lines.
Specialty:
Smooth printing, non stick and non dry mesh;
The hot pressing temperature is relatively low;
The adhesion strength between films is high (close to ACF).
Pre curing characteristics
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Appearance |
yello |
|
appearance |
yellow |
|
Viscosity |
50-60Pa·s |
Brookfield 52Z ,5rpm |
viscosity |
||
Specific gravity |
1.07 |
Cup |
proportion |
Specific gravity cup GB/T 13354-1992 |
|
Cure time |
10-15seconds |
140 ℃ -160 ℃ pressure 3Mpa |
Curing time |
||
Storage |
3months |
-Below 5 ℃ |
Storage conditions |
7days |
25℃ |
Characteristics after curing
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Pencil hardness |
HB-4B |
|
Hardness (pencil hardness) |
||
Peel strength |
32MPa |
Glass/FPC |
peel strength |
10mm/min |
|
Peel strength |
91N/25mm |
PET/FPC |
peel strength |
50mm/min |
|
Volume resistivity |
||
Volume resistance |
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