Application of 0.018mm gold-plated copper foil and 0.0125mm gold-plated PI in consumer electronics

Description:

PI is one of the organic polymer materials that can withstand high temperatures up to 400 degrees Celsius, with long-term use temperatures between 200 and 300 degrees Celsius. It has no obvious melting point and high insulation performance, making it suitable for diaphragm materials. By plating copper, nickel, silicon, gold, silver and other metal substrates on PI substrates, high film thickness of copper, nickel, tin, silver, gold can be achieved electromagnetic shieldingFunctions such as insulation, thermal conductivity, insulation, conductivity, and resistance adjustment.

characteristic:

1. Excellent resistance to high and low temperatures

2. Excellent mechanical and insulation properties

3. Good chemical stability

4. Good conductivity and electromagnetic shielding performance