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铜箔镀金铜箔镀锡 PI镀锡镀铜 PET镀银合金如何正确使用在各行业

Time：2021-12-14Number：1011

XJYYB-25系列镀金铜箔，基材为软态压延铜箔（>99.9%纯铜），基材具有良好的导电性，镀金表面电接触性能优良且具备的抗电化学腐蚀性，易钎焊。

根据客户需求，我司同时可以生产镀锡，镀银等其他金属镀层满足特殊应用，铜箔厚度10-100微米，幅宽达到540mm.

XJYYB-25Series gold plated copper foil, base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.

幅宽Width	520±10mm	卷尺测量Tape measurement
卷长Length	200m/Roll	卷尺测量Tape measurement
颜色Color	金色Gold Yellow	目测Visual
总厚度Total Thickness	26µm±10%	ASTM D1000
铜箔厚Copper Foil Thickness	25µm±10%	ASTM D1000
镀金层厚度Gold Coating	0.04µm±0.01	ASTM D1000
镀层结合力Cotaing Bonding Str	5B	内部标准Inside Standard
方阻Surface Resistance	≤0.02 Ω/ㅁ	Test by MIL-G-83528
盐雾测试Salt spray test	24Hrs	ASTM B117-2003

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Our main products include flexible substrate coating, shielding materials, absorbing materials, precious metal slurries, and more!

Provide customers with professional and convenient electromagnetic shielding and conductive material application solutions

Flexible electrode materials, shielding materials, conductive materials, absorbing materials, and new material technology solution providers

铜箔镀金铜箔镀锡 PI镀锡镀铜 PET镀银合金如何正确使用在各行业

Our main products include flexible substrate coating, shielding materials, absorbing materials, precious metal slurries, and more!

Provide customers with professional and convenient electromagnetic shielding and conductive material application solutions

Flexible electrode materials, shielding materials, conductive materials, absorbing materials, and new material technology solution providers

铜箔镀金 铜箔镀锡 PI镀锡 镀铜 PET镀银合金如何正确使用在各行业

铜箔镀金铜箔镀锡 PI镀锡镀铜 PET镀银合金如何正确使用在各行业